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Fabrication Engineering at the Micro- and Nanoscale 4th PDF: A Comprehensive Guide
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Action Steps:
- Direct-write high-resolution patterning (sub-10 nm routinely).
- Slow throughput, used for masks, prototypes, nanostructures.
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2. Key materials
- Silicon (single-crystal, SOI): mechanical, electronic, standard wafer platform.
- Metals: Au, Al, Cu, Ti, Cr — for interconnects, contacts, electroplating.
- Polymers: SU-8, PDMS, PMMA — for molds, soft lithography, microfluidics.
- Dielectrics: SiO2, Si3N4, Al2O3 — insulating layers, waveguides.
- 2D materials: graphene, MoS2 — emerging electronic/optical structures.
- Photoresists: positive (e.g., S1813), negative (e.g., SU-8), and e-beam resists (PMMA).
Nanotechnology and Manufacturing: The Future Is Bright | News & Insights How to Study from the Digital PDF Effectively


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