The DataCon 2200 EVO is likely a data center or server-related product, given the "DataCon" name. If you're seeking a manual or specifications for this product, I can offer some general guidance:
Datacon 2200 evo is a high-accuracy, multi-chip die bonder developed by BE Semiconductor Industries (Besi) datacon 2200 evo manual pdf kenya
: For a feature-rich overview that covers machine highlights and SiP specific features, you can refer to community-shared documents like the Besi Datacon 2200 EVO Features Overview on Scribd Key Specifications for Reference The DataCon 2200 EVO is likely a data
While Besi operates globally, regional support for high-end semiconductor equipment in East Africa typically involves international distributors or direct contact with Besi’s European or Asian headquarters. PDF Access: : For a feature-rich overview that covers machine
If you are buying this for a tender (e.g., County govt, UN project):
Avoid – the lack of proper certification in the manual will fail procurement compliance.
Local Distributors in Kenya: If the product is available in Kenya, local distributors or resellers might have more specific information or the manual you're looking for. Their websites or customer service could be a valuable resource.
2200 evo: The standard flexible platform for die attach and flip chip.